Nokia X5-01 (Black)

The Nokia X5 is a quirky slider that is sort of a mishmash between the recently launched Motorola Flipout and the Nokia X3. It is a music and communication centric handset with hi-fidelity built-in speakers, dedicated music keys, playlist DJ (creates a playlist depending on your mood) and Comes with Music access(selected regions). There is a full QWERTY keyboard for fast IM and email access and the battery life comes in at an impressive 16-days standby time or 24 hours music playback from a full charge.

The X5 packs a few unique features like a gently curving metallic back which comes into play when you use the Surprise Me! App & a chime that says the number of unread messages in your inbox when you shake the phone. The mobile comes preloaded with the Surprise Me! App that starts playing a random track everytime you spin the phone on its back.

Under the hood is an ARM11 600MHz CPU and 256MB of RAM, that should blaze through normal usage and even handle bit of multitasking. The mobile comes with 200MB of user memory, which can be increased up to 32GB with a microSD card. The X5 offers a plethora of connectivity options including HSDPA/HSUPA, Wi-Fi, Stereo Bluetooth and 3.5mm audio port.

The mobile is powered by S60 3rd edition, and is optimized for faster social networking, it brings up your contacts, emails and social networking feeds directly onto the home screen and supports instant status updates sans any secondary app. The X5 sports a 5-megapixel fixed-focus camera with LED flash, a minimum focusing distance of 50cm and an F2.4 aperture. It can also records VGA-resolution videos at 15fps. The browser supports Flash Lite 3.0(lets you stream Youtube videos directly on the browser), Mail for Exchange and Ovi Store access.

Specifications of Nokia X5-01 (Black)

• General 
• General Form:  Slider

• Size 
• Dimensions:  74.3 x 66.44 x 16.85 mm
• Weight:  129g (with battery)

• Display 
• Type:  TFT
• Resolution:  320 x 240 pixels
• Color:  262K colors
• Size:  2.36 inches

• Camera 
• Primary Camera:  5MP camera with Full Focus, LED Flash, Digital zoom up to 4x
• Video Recording:  Yes (VGA@15fps)

• Battery 
• Type:  Standard battery, Li-Ion 950 mAh (BL-5F)
• Talk Time:  5 h 2G / 3 h 30 min 3G (Maximum)
• StandBy Time:  384 h 2G / 384 h 3G (Maximum)

• Audio & Video 
• Music Player:  MP3/WMA/WAV/eAAC+ player
• Ringtone Formats:  Vibration, Polyphonic(64), WAV, MP3 ringtones
• Speaker:  yes (3.5mm Audio Jack)
• Radio:  Stereo FM radio with RDS
• Video Player:  MP4/H.264/H.263 player

• Data & Connectivity 
• GPRS:  Class 32
• EDGE:  Class 32
• 3G:  HSDPA
• Wlan:  Wi-Fi 802.11 b/g
• Bluetooth:  Yes, v2.1 with A2DP
• USB:  Yes, v2.0 microUSB
• WAP:  WAP 2.0

• Input 
• Keyboard Type:  QWERTY keyboard

• Platform 
• OS:  Symbian OS 9.3, Series 60 v3.2 UI
• CPU:  ARM 11 600 MHz processor
• Operating Frequency:  Quad-band EGSM 850/900/1800/1900 3GPP Rel. 5
• Java:  Yes, MIDP 2.0
• GSM/CDMA/Dual Sim/Triple Sim:  GSM

• Memory 
• Internal Memory:  200 MB
• Cards Slot:  MicroSD upto 32 GB , 2GB included   
• Phone Book:  Practically unlimited entries and fields, Photocall
• Call Records:  Detailed, max 30 days

• Other Features 
• Games:  Yes + downloadable
• Browser:  WAP 2.0/xHTML, HTML
• Messaging:  SMS, MMS, Pushmail, Windows Live Messenger, Yahoo! Messenger, Google Talk and Ovi Chat
• Miscellaneous:  Document viewer (Word Excel PowerPoint PDF), Flash Lite v3.0, Accelerometer sensor for auto rotate, Advanced contacts database with support for multiple phone and e-mail details per entry and thumbnail pictures, Nokia Xpress audio messaging

• Warranty 
•   1 Year Nokia India warranty for the phone and 6 months warranty for accessories.

Samsung Wave533 S5330 (Metallic Black)

Key Features of Samsung Wave533 S5330 (Metallic Black) 

•  Social Networking Integrated Phonebook
•  3.2 MP Camera
•  Advanced TouchWiz UI With Upto 10 Homescreens
•  Video Messaging & Streaming
•  Document Viewer(for Word - Excel & PDF Formats)

Samsung Wave533 S5330 (Metallic Black)

The Samsung Wave 2 Pro is the predecessor to the hughely successful Samsung Wave, and is Samsung's attempt to broaden the Bada platform's reach in the mid-range segment. It features a 3.2 inch 400 x 240 pixel display, 3 megapixel shooter, FM radio, 3.5mm audio socket, slide out,4 line QWERTY keypad, GPS and WiFi (including 802.11n) connectivity. The Wave 2 Pro supports Wi-Fi access even in no-SIM mode which renders it to be used as a mini Internet tablet if you have a WiFi connection.

The S5330 comes with a fully loaded media centre with Sound Alive 3D surround & 3.5mm audio jack for enhanced audio playback. The Music Recognition function helps you identify new songs and purchase them directly to the mobile. It supports the Social Hub app which seamlessly integrates all your phonebook contacts with your SNS, IM, e-mail and calendar accounts, saving you the hassle of having to open up seprate webpages. It even syncs with web calendars and send event invitations to friends instantly.

The mobile features a host of innovate social mapping tools so you can more easily share your location and your upadtes with your buddies. It offers constant Google Latitude and Geo-tagging support and let you stay connected with your friends no matter where you or they are. The Wave 2 Pro supports lightning quick 802.11 b/g/n Wi-Fi support for uninteruppted connectivity. It also comes with Bluetooth 3.0 for enhanced transfer speeds and wireless music streaming and microUSB for on-the-go charging.The mobile sports the Advanced TouchWiz UI that makes your mobile experience more intuitive and easy. The handset supports up to 10 enhanced homescreens and advanced widgets such as daily briefing and buddies direclty on the homescreen.

The Wave 2 Pro sports a 3.2 MP camera, and supports a decent set of scene modes & color correction to futher tweak your images. Samsung?s Bada platform gives you access to a plethora of applications from Samsung App store, the Wave 2 Pro features an integrated application store accessibility for downloading games, navigation & social networking tools, e-book, health and lifestyle applications. It comes pre-installed with Facebook and Twitter apps so you?ll always be in-sync with the latest updates and tweets, all from the convenience of your home screen.

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Specifications of Samsung Wave533 S5330 (Metallic Black)

• General 
• General Form:  Slider

• Size 
• Dimensions:  109.5 x 55 x 15.2 mm
• Weight:  118 g

• Display 
• Type:  TFT
• Resolution:  240 x 400 pixels
• Color:  256K colors
• Size:  3.2 inches

• Camera 
• Primary Camera:  3.15 MP, 2048x1536 pixels
• Video Recording:  Yes

• Battery 
• Type:  Standard battery, Li-Ion 1200 mAh

• Audio & Video 
• Music Player:  with Music Recognition & 3.5 mm audio socket
• Ringtone Formats:  Vibration, MP3 ringtones
• Speaker:  Yes
• Radio:  Stereo FM radio with RDS
• Video Player:  MP4/H.263/H.264 player

• Data & Connectivity 
• GPRS:  Class 10 (4+1/3+2 slots), 32 - 48 kbps
• EDGE:  Class 10, 236.8 kbps
• Wlan:  Wi-Fi 802.11 b/g/n
• Bluetooth:  Yes, v3.0 with A2DP
• USB:  Yes, microUSB v2.0

• Input 
• Keyboard Type:  QWERTY keyboard
• Touch Screen:  TouchWiz UI 3.0

• Platform 
• OS:  Bada OS
• Operating Frequency:  2G: GSM 850 / 900 / 1800 / 1900
• Java:  Yes, MIDP 2.0
• GSM/CDMA/Dual Sim/Triple Sim:  GSM

• Memory 
• Internal Memory:  100 MB
• Cards Slot:  microSD, up to 16GB   
• Phone Book:  Yes, Photocall
• Call Records:  Yes

• Other Features 
• Games:  Yes + downloadable
• GPS:  Yes, with A-GPS support
• Browser:  WAP 2.0/xHTML, HTML
• Messaging:  SMS, MMS, Push Email, Instant Messaging
• Miscellaneous:  Voice memo,TouchWiz UI 3.0, Multi-touch zoom, Image Editor, Voice Mail, Organizer, Accelerometer sensor

• Warranty 
•   1 Year Samsung India warranty for the phone and 6 months warranty for accessories.

Dell XCD28 (Black)

Key Features of Dell XCD28 (Black) 

•  Android V2.1(Eclair)
•  600Mhz ARM Processor
•  3.2MP Camera
•  3G

Specifications of Dell XCD28 (Black)

• General 
• General Form:  Candybar

• Size 
• Dimensions:  102 x 55 x 14.5 mm
• Weight:  100g

• Display 
• Type:  QVGA
• Resolution:  320 x 240
• Color:  262K
• Size:  2.8 inches

• Camera 
• Primary Camera:  3.2MP, Auto-focus
• Video Recording:  Yes

• Battery 
• Type:  1000mAH Li-Ion

• Audio & Video 
• Music Player:  Yes
• Speaker:  Yes
• Video Player:  Yes

• Data & Connectivity 
• GPRS:  Yes
• EDGE:  Yes
• 3G:  Yes
• Wlan:  Yes
• Bluetooth:  V2.1 with EDR
• USB:  Micro-USB

• Input 
• Touch Screen:  TFT resistive touch screen

• Platform 
• OS:  Android v2.1
• CPU:  ARM11 600Mhz
• Operating Frequency:  GSM 850/900/1800/1900 Mhz; UMTS 2100 Mhz
• Java:  Yes
• GSM/CDMA/Dual Sim/Triple Sim:  GSM

• Memory 
• Internal Memory:  200 MB User memory, 512M Flash, 256M RAM
• Cards Slot:  MicroSD (expandable upto 16GB)   
• Phone Book:  Yes
• Call Records:  Yes

• Other Features 
• Games:  Yes (downloadable)
• Browser:  Yes
• Messaging:  SMS, MMS, Email

• Warranty 
•   1 Year Dell India warranty for the phone and 6 months warranty for accessories

ARZ HAI...10

आँसू मैं ना ढूँदना हूमें,
दिल मैं हम बस जाएँगे,
तमन्ना हो अगर मिलने की,
तो बंद आँखों मैं नज़र आएँगे.
लम्हा लम्हा वक़्त गुज़ेर जाएँगा,
चँद लम्हो मैं दामन छूट जाएगा,
आज वक़्त है दो बातें कर लो हमसे,
कल क्या पता कौन आपके ज़िंदगी मैं आ जाएगा.

2)
पास आकर सभी दूर चले जाते हैं,
हम अकेले थे अकेले ही रेह जाते हैं,
दिल का दर्द किससे दिखाए,
मरहम लगाने वेल ही ज़ख़्म दे जाते हैं,
वक़्त तो हूमें भुला चुका है,
मुक़द्दर भि ना भुला दे,
दोस्ती दिल से हम इसीलिए नहीं करते,
क्यू के डरते हैं,कोई फिर से ना रुला दे,

ARZ HAI...9

ere Zakhmon Pe Aaj Tezab Ki Barish Karne Aye Hai
Hume Dafna Ke Unhe Chain Nahi Mila Isiliye To Aaj Humari Kabar Nilam Karne Aye Hai

Mit Gayi Hasti Humari Yeh Unke Liye Kam Tha
Behaya Ko Dekho Aaj Humari Parchai Mitane Ayi Hai

Pyar Ki Saza Dene Ke Liye Khud Ko Doob Gaya Hoon Ansuon Ke Dariya Mein
Humare Pas Kuch Hai Yeh Unse Bardasht Nahi Hua Isiliye Aaj Dekho Yeh Dariya Kharidne Aye Hai

Poncha Kar Chot Humari Dil Ko
Besharam Ko Dekho Tabyat Ka Hal Punchne Aye Hai

Khade Rehgaye Hai Ek Jagah Pe Iss Bhagdod Bari Zindagi Mein
Aaj Woh Hume Is Zindagi Se Alvida Kehne Aye Hai

ARZ HAI...8

Kabhi Kabhi Ratoon Mein Jagna Acha Lagta Hai
Unki Yaad Aati Hai To Maut Ka Samna Lagta Hai

Wo Bhool Gaye Har Wo Baat Jo Ki Thi Hum Se
Hume Aaj Bhi Un Baaton Ko Sunna Aur Sunana Accha Lagta Hai

Na Jane Wo Kahan Chali Gayi Chod Ke Mera Shaher
Mahefilen Ab Bhi Hazroon Hai Magaar Ye Shaher Virana Lagta Hai

Wo Bewafa Nahi Thi Doosto Uski Koi Majbori Hogi
Muskurati To Ajj Bhi Hai Wo Magar Chahera Begana Lagta Hai

Jab Se Usne Choda Hai Saath Hamara Kasam Se Doosto
Mera Ghar Mera Shaher Ye Sub Khuch Qadeer Maiqana Lagta Hai

Kahoon Ke Mein Uski Juda-E- Ke Alam Mein Kya Lagta Hai
Uski Beruqi Jaise Maiqana Aur Yaad Paimana Lagta Hai

ARZ HAI...7

pyar hai to aansuo ki bhi shaan hoti hai,
pyar na ho to mehfil bhi samshan hoti hai,
sara khel to pyar ka hi hai,
warna janaza or baraat ek samaan hoti hai

ARZ HAI...6SA

Barbaad Hone Do Mujhe, Apni Nazron Se Girne Do Mujhe
Aaj Us Bewaffa Ki Yaad Mein, Jalne Do Muhhe

Aab Hum Jeeyein To Kiss Ke Liye
Maut Ki Raah Par Chalne Do Mujhe

Mat Roko Humein Fanna Hone Se
Tadapti Shamma Ki Tarah Bujne Do Mujhe

Nah Do Humein Rishto Ka Vaasta Tum
Kagaz Ki Kashti Ki Tarah Dubne Do Mujhe

Mat Sikhao Humein Hasna Tum
Saans Lene K Andaaz Bulne Do Mujhe

Mat Dekho Humari Nigahon Mein
Tanhai Mein Aashq Bahane Do Mujhe

Dil Aur Rooh Ko Shikayat Hai Mujse
Kabr Ke Us Par Chupne Do Mujhe

Ishq Mein Marna, Kaam Hai Deewano Ka
Fanna Ho-Kar, Yhe Rasm Nibane Do Mujhe

ARZ HAI...5

Kabhi usne apna hame banaya hi nahi ,
jootha hi sahi pyaar jataaya hi nahi.
kasoor apna hum maan bhi jaate,
par kya kare kasoor hamara hume btaya hi nahi

ARZ HAI...4

ae khuda nazron ko kuch aisi khudai de jidhar dekhon bas wo hi dikhai de
kaash koi aisi baat ho hawa me usko pukaron to bas usi ko sunai de

ARZ HAI...3

Unki Yaad Me Ankhen Zara Bhigo Lete,
Udaaas Raat Ki Tanhaiyon Me So Lete,
Akele Gham Ka Bhoj Sambhalta Nahi,
Agar Tum Mil Jaate Toh Lipat Kar Ro Lete....

ARZ HAI...2

Mujhe Bhi Kisi Se Pyar Tha
Main Zinda Bhi To Ek Laash Tha
Jab Mar Gaya Us Ke Intezar Mein
To Khuda Ne Bhi Kaha
Kyon Kiya Us Se Pyar Jise Kisi Aur Ka Intezar Tha

ARZ HAI...1

Kab Hui Pyar Ki Barsaat Mujhe Yaad Nahi,
Khauf Me Doobi Mulakat Mujhe Yaad Nahi,
Me Tho Madshosh Tha Uski Chahat Mein,
Usne Kab Choor Diya Saath Mujhe Yaad Nahi

ARZ HAI...

Abhi Ke Liye Ye Duri Hum Seh Lenge
Abhi Keliye Tanha Hum Reh Lenge
Kisi Din Tum Aake Humare Ho Jaana
Abhi Ke Liye Aapka Deewana Hum Keh Lenge

Meri Har Khushi Har Dilkashi Mein Aap Mera Sath Rahe
Aapki Hargham Har Sitam Mein Main Aapka Sath Rahun
Meri Har Nadaaniyon Ko Aap Haskar Sahe
Aap Ruthe Rahe Mein Manatha Rahun

Dil Karta Hai Ki Tujhe Dekthe Jaun
Tere Har Ada Ko Apni Dil Ke Tasveer Pe Laun
KAash Tum Chand Ki Jaise Hoti
Itni Duri Se Bhi Tumko Main Dekh Paun

Shukar Hai Bhagwan Ka Usne Duniya Gol Banayi Hai
Jitni Dur Wo Gayi Utni Paas Bhi To Aayi Hai

Material Specification use in Caster Refractory

Material Specification of Ladle Shroud

·         Chemical Composition

Particulars	Wt %
Al2O3	51.8
C	30.9
SiO2	14.8
TiO2	1.0
Fe2O3	0.5
MgO	0.1
CaO	0.1
Si	-
Na2O	-
ZrO2	-

·         Physical Properties

Bulk Density (gm/cc)	2.34-2.46
Apparent Porosity	14.2-18.7
CCS (Kg/cm2)	-
Modulus of rupture (N/mm2)	4.6-10.1

Material Specification of Monoblock Stopper

·         Chemical Composition

Type	WX 01	HX 01
Particulars	Wt %	Wt %
Al2O3	7.0	51.8
C	27.1	30.9
SiO2	0.0	4.8
TiO2	0.02	1.0
Fe2O3	0.4	0.5
MgO	59.0	0.10
CaO	0.8	0.10
Si	-	-
Na2O	-	-
ZrO	0.04	-

·         Physical Properties

TYPE	WX 01	HX 01
Bulk Density (gm/cc)	2.27-2.45	2.34-2.46
Apparent Porosity	10.1-17.9	14.2-18.7
Modulus of rupture (N/mm2)	6.4-19.2	4.6-10.1

Material Specification of Sub Entry Nozzle

·         Chemical Composition

Type	WX 01	HX 12	TX 15
Particulars	Wt %	Wt %	Wt %
Al2O3	7.0	40.0	0.3
C	27.1	28.0	19.6
SiO2	0.0	18.0	1.4
SiC	-	-	-
Fe2O3	0.40	-	0.1
MgO	59.0	-	-
CaO	0.8	-	3.4
Si	-	-	-
Na2O	-	-	-
ZrO	0.04	8.0	73.9

·         Physical Properties

TYPE	WX 01	HX 01	TX 15
Loss on Ignition (%)	-	-	-
CCS (Kg/cm2)	-	-	-
Bulk Density (gm/cc)	2.27-2.45	2.30-2.46	3.47-3.65
Apparent Porosity	10.1-17.9	13.5-9.0	12.5-17.5
Modulus of rupture (N/mm2)	6.4-19.2	5.0	5.5

Influence of Composition on Defects in Continuously Cast Products

 Influence of Composition on Defects in Continuously Cast Products

Of the many types of defect in continuously cast product, only transverse surface cracks are known to be strongly influenced by the microalloying elements V, Nb and Ti. Some of the other types of surface defect, such as longitudinal surface cracks, are influenced by composition, particularly C (0.07-0.18% being prone to longitudinal cracking) S, P, and Mn/S ratio, increased P and S, and decreased Mn/S ratio leading to increased cracking. Internal crack formation is also influenced by composition, and again C, S and P are particularly important.

Cracking is much more likely to occur if regions of low ductility are present.It is possible to identify 4 distinct regions of low ductility under test conditions relevant to continuous casting. These four regions are illustrated on a schematic hot ductility curve, 

Region I - Embrittlement by Incipient Melting

Region IIa - Embrittlement by Second Phase Particles - (Mn,Fe)S

Region IIb- Embrittlement by Second Phase Particles - Nb(CN), AlN, V(CN)

Region III - Embrittlement by Transformation

Region I occurs at high temperatures, typically 20-50°C below the mean solidus temperature. Fracture surfaces are characterized by inter-dendritic failure and the presence of particles such as MnS. This region of low ductility is associated with incipient melting at interdendritic and grain boundaries, and is important in the formation of many types of defect in continuously cast products, such as longitudinal surface cracking. The segregation of elements such as S to inter-dendritic regions during solidification is important to this type of

failure. This region of low ductility may be responsible for the initiation phase of transverse surface cracks, as small subsurface cracks have been observed associated with oscillation marks.The oscillation marks themselves are regions in which high degrees of segregation of elements such as S, P and Mn can occur. Heat transfer to the mould in the vicinity of the oscillation mark is also reduced, which will tend to keep temperatures high, and within the brittle zone.

 

Region II occurs over the approximate temperature range 1200-900°C, depending on composition and test conditions, and fracture surfaces are typically along austenite grain boundaries, and sometimes show the presence of second phase particles, with ductile dimples around these second phase particles. These low ductility regions are associated with precipitates - (Mn,Fe)S for Region IIa and Nb(CN), V(CN), Ti(CN) and AlN for Region IIb. The distinction between regions IIa and IIb is determined by the stability of the different particle types. Type IIa low ductility is only apparent at quite high strain rates; at lower strain rates, or when there is an extended hold prior to testing, ductility is good. On the other hand, Type IIb ductility loss is worse as strain rate decreases. Type IIa ductility loss is strongly dependent on composition, particularly Mn/S ratio. It has also been suggested that IIa ductility loss is due to the precipitation of liquid FeS particles, and reduction of grain boundary decohesion due to S segregation.Transverse cracking is usually associated with high strength microalloyed steels, with high Mn contents, and therefore high Mn/S ratios. The strain rates during the processing of continuously cast slabs are also too slow for Type IIa ductility loss to occur, and this suggests that type IIa ductility loss is not responsible for transverse crack formation. Type IIb ductility loss is initiated by austenite grain boundary sliding, which encourages crack formation at grain boundaries and the presence of second phase particles such as Nb(CN), V(CN) or AlN. These particles have two major roles; they can delay the onset of recrystallisation, and they can reduce the strain required for fracture. The high temperature end of this ductility trough is believed to be associated with the onset of recrystallisation. If recrystallisation can occur prior to failure, any developing grain boundary cracks become isolated, and further propagation is not possible. It is well known that the microlloying elements Nb and V can delay recrystallisation, either in solution or as precipitates, and this retardation of recrystallisation is believed to be responsible for extending the Type IIb ductility trough to higher temperatures. However, in this respect, V is much less effective than Nb in delaying recrystallistion. The presence of microalloy precipitates can also reduce the strain to fracture by a number of possible mechanisms: precipitate free zones are often observed adjacent to austenite grain boundaries, and this may lead to strain concentration at the grain boundary; the particles (or groups of particles) at the grain boundaries may act as crack initiation sites; or general matrix precipitation can lead to an increase in strength, and an overall reduction in ductility. The proposed mechanism for low ductility failures in the presence of Nb and V carbonitrides.

Region III occurs over the approximate temperature range 900-600°C, depending on composition, and if Type II low ductility is present, these two ductility troughs can merge together. Fracture surfaces are characterised by intergranular failures, and the facets of the individual grains are often associated with void formation around second phase particles. It is believed that this region of low ductility is associated with the austenite to ferrite transformation. On cooling below the transformation temperature, ferrite formation

commences at austenite grain boundaries, leading to the formation of films of ferrite around the austenite grains. At temperatures within the transformation range, ferrite is softer than austenite and so when deformation commences, strain is concentrated within the ferrite at grain boundaries, and the processes of ductile failure, i.e. void nucleation at second phase particles, and the growth of these voids, continues within the ferrite film.Thus on a microscopic scale, fracture can be described as ductile, but overall the failure is brittle. The mechanism for this type of fracture is illustrated . The high temperature end of the ductility trough is associated with the start of transformation, and is thus determined by composition and processing conditions. There appears to be a good relationship between the temperature at ductility starts to fall and the Ar3 temperature, the transformation temperature measured during cooling. It has also been suggested that the temperature at which ductility starts to fall is very close to the equilibrium transformation temperature Ae3, rather than the Ar3, as the deformation process accelerates the transformation kinetics. Ductility recovers at lower temperatures because the volume fraction of ferrite is higher, and the strain distribution between austenite and ferrite becomes more uniform. At lower temperatures, the strength differential between austenite and ferrite is also less, which will again contribute to a more uniform distribution of strain between austenite and ferrite. For ductility to recover completely, it appears that approximately 50% of the austenite must have transformed to ferrite, Microalloying elements can influence the position of this type of ductility trough through their influence on transformation temperature. For example, the presence of Nb in solution prior to transformation is known to reduce transformation temperatures, and has also been shown to reduce the temperature at which the type III ductility trough occurs, In this respect V also has a lesser effect, as quite large additions of V are required to depress the transformation temperature significantly. Microalloys can also deepen this type of ductility trough when they are present in the form of precipitates. The precipitates may act as nucleation sites for voids within the thin ferrite films, or reduce the ductility of the thin ferrite films by retarding recovery processes.